Huawei is launching a mobile soc built with logic folding. They take a single logic ip, like a cpu, and spread it's components across to dies and use hybrid bonding to combine top to bottom. For example the CPU SRAM on top and logic gates directly below. This reduces critical path, increases fmax, reduces power consumption. They claim this method allow them build faster, more power efficient, more function units with duv process than traditional duv. Will be interesting to benchmark after launch later this year
